Divided processing "Drilling processing (TGV)"
There are no microcracks (invisible fine scratches), so it maintains high strength.
The "Hole Drilling Process (TGV)" is a segmented processing method that achieves both high production efficiency and strength. It is designed for applications such as LCD displays, semiconductor devices, and 2.5D and 3D packaging, allowing for fine processing on large glass substrates measuring 730x920mm, with diameters ranging from φ20μm to φ200μm. It can also accommodate processing in the mm order for diameters of approximately φ10mm. 【Features】 ■ Capable of maintaining high strength without the occurrence of microcracks ■ Integrated processing for hole drilling and chemical etching is possible *For more details, please refer to the PDF document or feel free to contact us.
- Company:NSC
- Price:Other